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Next, cut the processor in half to take a cross-section photo. Band saws are much too crude for this, so we actually grind through the processor slowly, taking off very small amounts of material as we go.
  • Next, cut the processor in half to take a cross-section photo.

  • Band saws are much too crude for this, so we actually grind through the processor slowly, taking off very small amounts of material as we go.

  • You can see why it can be tough to take a clear, solid photo of a package's cross-section. The processor is actually one of the larger packages in the iPhone, and still very finicky to handle. Imagine trying to do this with a package a tenth of its size.

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Hier Übersetzung einfügen

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