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Schritt 13
Okay, so Apple made a PCB sandwich, but how does it work? They created a third spacer PCB that lines the perimeter. And instead of connecting the two layers with a fussy flex cable, data travels along dozens of through-hole vias. Here, the A11 SoC lies nestled at the center of the main board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.
  • Okay, so Apple made a PCB sandwich, but how does it work?

  • They created a third spacer PCB that lines the perimeter. And instead of connecting the two layers with a fussy flex cable, data travels along dozens of through-hole vias.

  • Here, the A11 SoC lies nestled at the center of the main board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.

Ok, Apple ha fatto un circuito stampato a sandwich, ma come funziona?

Ha creato un terzo circuito stampato che funge da distanziale lungo il perimetro. E invece di unire i due strati con un fastidioso cavo flessibile, i dati viaggiano lungo dozzine di Via (vertical interconnect access) passanti.

Qui il SoC A11 trova posto al centro della scheda principale. Puoi farti un'idea della struttura 3D della scheda guardando le foto a raggi X. I cilindri attorno al bordo sono fori riempiti con materiale di saldatura per connettere le due schede.

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