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Schritt 2
Place a heat shield over the other parts of the motherboard to avoid overheating. Heat the affected area with a heat gun to reflow the solder. Reflowing heats up all the soldering joints in an area so they become liquid enough to reinforce the bonds. This allows electricity to flow through the bond without unexpected resistance.
  • Place a heat shield over the other parts of the motherboard to avoid overheating.

  • Heat the affected area with a heat gun to reflow the solder.

  • Reflowing heats up all the soldering joints in an area so they become liquid enough to reinforce the bonds. This allows electricity to flow through the bond without unexpected resistance.

Hier Übersetzung einfügen

Hier Übersetzung einfügen

Hier Übersetzung einfügen

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