Since the lower layer is badly deformed, we need to transplant baseband CPU, baseband EEPROM and the NFC chip on the original lower layer to a new lower layer.

Detach baseband CPU, baseband EEPROM and the NFC chip from the new lower layer. Clean the three bonding pads afterwards.

Heat with Hot Air Gun to remove baseband CPU, baseband EEPROM and the NFC chip of the original lower layer. Then get the three chips reballed.

Solder the reballing-finished NFC chip, baseband EEPROM and baseband CPU to the new lower layer.