Schritt 11 übersetzen
Schritt 11

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Our friends at Chipworks have spent the last two weeks hard at work cracking the S1. Here's what they found:
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The Apple S1 System in Package (SiP) is composed of over 30 individual components, attached to a single board that is then overmolded with a silica or aluminum composite resin—similar to conventional IC packaging, but for an entire board.
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At the heart of the S1, Apple's new APL0778 processor is fabbed on Samsung's 28 nm LP process.
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Check out Chipworks' full analysis here.
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