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Let us take a look at what silicon is so heavily guarded by the charging case: STMicroelectonics STM32L072 ARM Cortex-M0+ MCU Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?
  • Let us take a look at what silicon is so heavily guarded by the charging case:

  • STMicroelectonics STM32L072 ARM Cortex-M0+ MCU

  • Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?

  • NXP Semiconductor CBTL1610A3 charging/port controller IC (as seen in iPhones 6s and SE and both iPad Pro models)

  • Texas Instruments BQ24232 power management IC

  • Maxim Integrated MAX9028 1.8 V comparator

  • AMS AS3441 power and communication interface (likely)

  • Probably ON Semiconductor regulators

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