Änderungen an Schritt Nr. 5
Bearbeitet von Mihir Deshmukh —
Bearbeitung genehmigt von Mihir Deshmukh
- Gelöscht
- Hinzugefügt
- Unverändert
Schritt-Zeilen
| [* black] Wedge the plastic opening tool underneath the motherboard which is located at the top of the phone. |
| [* black] Wedge the plastic opening tool underneath the motherboard which is located at the top of the phone. |
| [* black] Push down on the plastic opening tool, lifting the motherboard away from the phone. |
| [* black] Continue to do this around all sides of the motherboard until it is fully removed from the phone. |