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Änderungen an Schritt Nr. 5

Bearbeitet von Mihir Deshmukh

Bearbeitung genehmigt von Mihir Deshmukh

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[* black] Wedge the plastic opening tool underneath the motherboard which is located at the top of the phone.
[* black] Wedge the plastic opening tool underneath the motherboard which is located at the top of the phone.
[* black] Push down on the plastic opening tool, lifting the motherboard away from the phone.
[* black] Continue to do this around all sides of the motherboard until it is fully removed from the phone.