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Änderungen an Schritt Nr. 6

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Bearbeitung genehmigt von Evan Noronha

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[* black] We peel the motherboard out of the chassis to get a better look at this wearable's hardware:
[* red] SK Hynix H9U32A4AGDMC. The Qualcomm Snapdragon 400 SoC is hidden beneath this DRAM device.
[* orange] Qualcomm PM8226 PMIC
[* yellow] Broadcom [https://chipworks.secure.force.com/catalog/ProductDetails?sku=BRO-BCM4343WKUBG&viewState=DetailView&cartID=&g=|BCM4343|new_window=true] integrated communications module
[* green] Synaptics S3526B Touch Controller
- [* light_blue] Invensense [http://www.invensense.com/mems/gyro/mpu6050.html|M651|new_window=true] 6-axis accelerometer and gyro, Asahi Kasei [http://www.digikey.com/catalog/EN/partgroup/ak8963/44099|AK8963|new_window=true] 3-Axis Compass IC
+ [* light_blue] Invensense [http://www.invensense.com/mems/gyro/mpu6050.html|M651|new_window=true] 6-axis accelerometer and gyro, Asahi Kasei [http://www.digikey.com/catalog/EN/partgroup/ak8963/44099|AK8963|new_window=true] 3-axis Compass IC
[* blue] WCD9302 OVV
[* violet] PPG Sensor

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