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Änderungen an Schritt Nr. 6

Bearbeitet von CChin -

Bearbeitung genehmigt von Arthur Shi

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[* black] We peel the motherboard out of the chassis to get a better look at this wearable's hardware:
- [* red] SK Hynix [https://chipworks.secure.force.com/catalog/ProductDetails?sku=HYN-H9TU32A4GDMC-LRKGM&viewState=DetailView&cartID=&g=|H9TU32A4GDMC|new_window=true] 512 MB mobile DDR2. The Qualcomm Snapdragon 400 SoC is hidden beneath this DRAM device.
- [* orange] Qualcomm PM8226 PMIC
+ [* red] SK Hynix [https://chipworks.secure.force.com/catalog/ProductDetails?sku=HYN-H9TU32A4GDMC-LRKGM&viewState=DetailView&cartID=&g=|H9TU32A4GDMC-LRKGM|new_window=true] 512 MB mobile DDR2. The Qualcomm Snapdragon 400 SoC is hidden beneath this DRAM device.
+ [* orange] Qualcomm PM8226 Power Management
[* yellow] Broadcom [https://chipworks.secure.force.com/catalog/ProductDetails?sku=BRO-BCM4343WKUBG&viewState=DetailView&cartID=&g=|BCM4343|new_window=true] integrated communications module
- [* green] Single microphone—we're not sure why there were two ports; maybe just symmetry?
- [* light_blue] Vibrator motor—soldered in place on the motherboard
+ [* green] Texas Instruments [link|https://www.ti.com/product/BQ27421-G1|BQ27421-G1] Battery Fuel Gauge
+ [* light_blue] Single microphone (Knowles) —we're not sure why there were two ports; maybe just symmetry?
+ [* blue] Vibrator motor—soldered in place on the motherboard

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