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Änderungen an Schritt Nr. 6

Bearbeitet von Evan Noronha -

Bearbeitung genehmigt von Evan Noronha

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Schritt-Zeilen

[* black] We peel the motherboard out of the chassis to get a better look at this wearable's hardware:
[* red] SK Hynix H9U32A4AGDMC
+ [* icon_note] The Qualcomm Snapdragon 400 SoC is hidden beneath the DRAM device.
[* orange] Qualcomm PM8226 PMIC
[* yellow] Broadcom [https://chipworks.secure.force.com/catalog/ProductDetails?sku=BRO-BCM4343WKUBG&viewState=DetailView&cartID=&g=|BCM4343|new_window=true] integrated communications module
[* green] Synaptics S3526B Touch Controller
[* blue] WCD9302 OVV
[* violet] PPG Sensor