Änderungen an Schritt Nr. 11
Bearbeitet von backstroke –
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Schritt-Zeilen
[* black] The front side of the motherboard contains the following major chips: | |
[* red] Toshiba TC31501AAMBG WiMax package. According to [http://www.chipworks.com|Chipworks], "This device operates in the 2.5GHz frequency band and offers high-speed connectivity in the mobile environment with low power consumption." (Thanks guys!) | |
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+ | [* orange] Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4330|BCM4330XKFFBG] 802.11 a/b/g/n MAC/Baseband/Radio with Integrated Bluetooth 4.0+HS and FM Transceiver/Receiver |
+ | [* yellow] Maxim [link|http://www.semiconductorpackagingnews.com/articles/article_29349.shtml|MAX8997] Power Management IC |
[* blue] WIP4255H | |
[* green] Avago CFI120 223713 | |
[* violet] Maxim [link|http://www.maxim-ic.com/datasheet/index.mvp/id/6483|MAX8893C] Power Management IC |