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Änderungen an Schritt Nr. 6

Bearbeitet von Javier Delgado -

Bearbeitung genehmigt von Javier Delgado

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[* black] Gently rock the plastic spudgeropening tool back and forth until the motherboard releases from the phone.
[* black] Gently rock the plastic spudgeropening tool back and forth until the motherboard releases from the phone.
[* icon_caution] Adhesion, identified with red circles, bonds the motherboard to the chassis. This may require extra effort to lift off from back of phone.