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Änderungen an Schritt Nr. 5

Bearbeitet von Macy Wright -

Bearbeitung genehmigt von Macy Wright

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[* black] UsingWedge a plastic opening tool, prytool into the seam between the top cover and bottom casing of the device from the bottom compartmentand create a gap.
[* black] UsingWedge a plastic opening tool, prytool into the seam between the top cover and bottom casing of the device from the bottom compartmentand create a gap.
[* icon_caution] Prying open the device is quite difficult and requires a large amount of force. Use caution to avoid breaking the device or hurting yourself.
[* black] GentlyAfter you have created a gap large enough to fit your fingers between, gently lift up the top cover to open the device and reveal the motherboard.
[* black] GentlyAfter you have created a gap large enough to fit your fingers between, gently lift up the top cover to open the device and reveal the motherboard.