How difficult is doing board level repairs on an iPhone X?
I have an Iphone X that I believe has a faulty Charging IC, however after doing a bit of research about doing board level repair work on an Iphone X I saw others essentially taking their heating tools and separating the entire board into sections, as the Iphone X board apparently is several layers of chips all stacked on top of one another.
My main concern, then, is essentially whether or not I’ll need to reball literally the entire perimeter of the board once I engage in this separation or if the balling is simply there to help keep everything together, and a few joints here or there that aren’t 100% perfect won’t affect the functionality of the device. If it’s the former then I might just have to skip the X when it comes to board level repairs, because that’s a level of commitment that’s far and above what was required for previous models of both Iphone AND Android phones.
As an addendum: If anyone does have advice for actually doing the IC replacement as well those comments are also welcome.
Ist dies eine gute Frage?