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Werkzeug & Ersatzteile

Hilfe

Aktuelle Version von: Chris C ,

Text:

Reflowing the mobo in the oven would not be advised in my opinion due to the fact that the parts on the bottom can drop of since it is a double sided board.
 
I would use the heat gun reflow method. There are many videos on Youtube. Much easier, be sure not to overheat or bump the board while it is hot otherwisehot. Otherwise, you are pretty much doing the same thing that is done during manufacturing.
I would use the heat gun reflow method. There are many videos on Youtube. Much easier, be sure not to overheat or bump the board while it is hot otherwisehot. Otherwise, you are pretty much doing the same thing that is done during manufacturing.
 
From what I have researched it seems to be issues with the BGA (Ball Grid Array) under some of the chips as well as poor heatsink compound.
 
Some people have had good luck with the reflow and new heatsink compound (artic silver is best).

Status:

open

Ursprünglicher Beitrag von: Chris C ,

Text:

Reflowing the mobo in the oven would not be advised in my opinion due to the fact that the parts on the bottom can drop of since it is a double sided board.

I would use the heat gun reflow method.   There are many videos on Youtube.  Much easier, be sure not to overheat or bump the board while it is hot otherwise you are pretty much doing the same thing that is done during manufacturing.

From what I have researched it seems to be issues with the BGA (Ball Grid Array) under some of the chips as well as poor heatsink compound.

Some people have had good luck with the reflow and new heatsink compound (artic silver is best).

Status:

open