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Ursprünglicher Beitrag von: Minho ,


When it comes to reballing IC’s in iPhones/iPads or other smartphones, a solder paste and appropriate stencil is the best way forward. There are plenty of Youtube videos on how to reball IC’s using this technique.

I do have an assortment of solder balls, ranging from 0.2mm up to 0.8mm that I use occasionally if only one ball is muffed up. IC’s have different pitches and sizes so you need to have a wide assortment.

Those reballing large CPU’s, for example on gaming consoles, will prefer to use solder balls.