Microsoft Surface Pro 5
Property: BUILD-OPT
DNP = Do Not Place
| Sheet | Name | Sheet | Name | Sheet | Name |
|---|---|---|---|---|---|
| Table of Contents | 31 | Button & Diagnostic Conn | 61 | +IVSB | |
| 2 | Build Options | 32 | On Board-Sensors | 62 | +1.8VSB & Load SW |
| 3 | 33 | 63 | CHARGER | ||
| 4 | CLOCK DISTRIBUTION | 34 | PECI | 64 | +SV Load SW |
| 5 | SIGNAL & RESET MAP | 35 | Silego Controller | 65 | +3P3V Load SW |
| 6 | POWER FLOW (1 OF 3) | 36 | SAM Power, ADC, & Debugl | 66 | Controller 1 |
| POWER FLOW (2 OF 3) | 37 | SAM Buses & Gpio | 67 | IA and SA | |
| 8 | POWER FLOW (3 OF 3) | 38 | TPM | 68 | Empty |
| 9 | I2C MAP | 39 | Temp SensorlSystem Fan | 69 | GT |
| 10 | CPU(1)_MISC JTAG DDI EDP | 40 | REALTEK ALC3269C 81BGA | 70 | SLI Power, Battery Conn |
| 11 | CPU(2) LPDDR3 | 41 | Audio Jack /Spkr | 71 | SL1 Signals |
| 12 | CPU(3)_POWERI | 42 | Microphone rear | 72 | +3P3V_HPD/LCD backlight/TBl |
| 13 | CPU(4)_POWER2 | 43 | SSD_1 | 73 | Debug_Expansion Connector |
| 14 | CPU(5)_GND | 44 | SSD_2 | 74 | Blade Interface |
| 15 | CPU(G)_CFG RESERVED | 45 | USB3.0 | 75 | Power Protect |
| 16 | LPDDR3(1)_ MEMORY DOWN | 46 | 76 | Shields, TPs, & Mechanical | |
| 17 | LPDDR3(2)_MEMORY DOWN | 47 | mDP | ||
| 18 | XDP | 48 | SDXC | ||
| 19 | LPDDR3(3)_CA/DQ Voltage | 49 | 1c Camera IR | ||
| 20 | PCH(1) SDHDARTC CLK | 50 | Wi-Fi_BT | ||
| 21 | 51 | Empty | |||
| 22 | PCH(3)_SYS PWR CONTR | 52 | Camera Power | ||
| 23 | PCH(4)_CCL HWID | 53 | Camera Rear | ||
| 24 | PCH(S)_PCIEUSB | 54 | Camera Front | ||
| 25 | PCH(6)_CPU,GPIOMISC | 55 | 3P3VA & Reset | ||
| 26 | PCH(Z)_POWER | 56 | +VCCIO | ||
| 27 | PCH(8)_empty | 57 | eDP connector | ||
| 28 | Power Monitor | 58 | +VCCEDRAM & +VCCEOPIO | ||
| 29 | Sl Coupon | 59 | +SVSB & +3P3VSB | ||
| 30 | Touch Con & Key | 60 | +1P2V DUAL&+VTT |
Table Caption: This table lists sheet numbers and their corresponding names, likely representing sections or pages within a technical document such as a schematic or bill of materials.
W x H 457 x 296 mm
Size
Project Name
Rev
Date:
Sheet
of
Title:
Engineer:
Custom
1
76
Tuesday, December 13, 2016
Table of Contents
1.00
KBL M DV1p0
<OrgAddr1>
<Variant Name>
Size
Project Name
Rev
Date:
Sheet
of
Title:
Engineer:
Custom
1
76
Tuesday, December 13, 2016
Table of Contents
1.00
KBL M DV1p0
<OrgAddr1>
<Variant Name>
Size
Project Name
Rev
Date:
Sheet
of
Title:
Engineer:
Custom
1
76
Tuesday, December 13, 2016
Table of Contents
1.00
KBL M DV1p0
<OrgAddr1>
<Variant Name>
5
4
3
2
| BUILD-OPT | BOMAssy | Remarks |
|---|---|---|
| ALL | Common | DEFAULT- Populatedas showninCoreschematicforall variants |
| DNP | Common | O-OTUFFforall variants |
| TBL1001 | Common | CPUselection(InCommon;NoOOCbasedvariants) |
| TBL3602 | Common | ResJumpers(InCommon;NoOOCbasedvariants) |
| U23E | Common | OnlypopulatedtosupportU23evariants(InCommon;NoOOCbasedvariants) |
| TBL2301 | BdID | ResJumpers |
| TBL3601 | BdID | ResJumpers |
| TBL1601 | Mem | LPDDR3M emoryAssemblyOptions |
| TBL3801 | TPM | OecurityDeviceOptions |
| TBL4301 | OOD | OODM emorypartoptions |
| OOD1 | OOD | OnlypopulatedforsingleOODconfigurations. |
| OOD2 | OOD | Onlypopulatedfordual OODconfigurations. |
| O | Debug | Legacy- OriginallyintendedsameasDBG_O. pleasereplacewithDBG_O, DBG_R, orDBG_Dasappropriate. |
| DBG | Debug | Legacy- OameasDBG_Dshownbelow. PartdepopulatedforM P. |
| DBG_D | Debug | DebugPart- RemovefromBOM(Depopulate)forM P |
| DBG_N | Debug | Non-DebugPart- Installedonlyinnon-debugbuilds |
| DBG_R | Debug | DebugPart- ReplacewithlowercostcomponentforM P(Ex;replaceprecisionshuntwith0-ohmjumper) |
| DBG_O | Debug | DebugPart- ReplacewithboardshortforM P(notcommonlyusedanymore) |
| DBG_T | Debug | DebugPart- UsedforPowerTelemetryinM Pasneeded. |
| XDP | XDP | Legacy- OameasXDP_D |
| XDP_D | XDP | OnlyusedasneededforCPUDebug. DepopulatedforM PandmostEV/DV/PVassemblies. |
| FAN | FAN | PartsusedtosupportFanoption. |
Table Caption: This table lists different build options (BUILD-OPT) and their corresponding Bill of Materials Assembly (BOMAssy) designations, along with remarks explaining their purpose or usage, particularly in relation to different hardware variants and debug functionalities.
| Primary Part | Primary Part Description | Part | Substitute Part Description | Reference Designator |
|---|---|---|---|---|
| X910478-001 | CAP-POLY-TANT,SM,47 uF,16 V,20%,200 mOHM,1210 | X944915-001 | [CAP-POLY-TANT SM,47 uF,16 V,20%,90 mOHM,1210 | C6334,C6335,C6351,C6352 |
| X950699-001 | IND-FER-COMMON MODE, SM,160 mA,25%,50 OHM,0504 | X869713-001 | ||
| M1OO6065-001 | IND, COMMON MODE, 1OOmA,SURFACE MOUNT,90 OHM,2 LINE | X888388-001 | IND-FER-COMMON MODE,SM,100 mA,20%,90 OHM,1OOMHZ,0302,NOT FOR NEW DESIGN | L4905,14906,15301,15302,15303,15304, |
| X911507-001 | IND-PWR,SM,10 uH,2.5 A,154 mOHM, 20%,5.4X5.2X1.8MM | M1002310-001 | IND,POWER MULTILAYER, 1OuH, 2.6A,209,145mOhm SURFACE MOUNT,5P4*5P2MM | L7204 |
| X865865-001 | TRA-N-CNLSM,VMT3,20 V,200 mAmp,8 Vx885388-001 | TRA-N-CNL,SM,2-L1B,20 V,250 mAmp,10 V,SSM3K37MFV | PQ5506,PQ7505,02002,02101,02102, 02501,02502,03001,03004,04301 , Q4701,05301,05401,05702,06306 , 06307,07000,07102,07201,01001 | |
| X861507-001 | RES-FXD,SM,49.9 OHM, 1%,1/20W,0201 | X878664-001 | R1027,R1029,R1507,R2231,R2241,R6606, R6617 |
Table Caption: This table lists electronic components, including their primary part number and description, as well as any available substitute part numbers and descriptions, along with their reference designators on a circuit board.
1
D
C
B
A
Rizht
Speaker
5
5
Shared
Program specific
Instant mic
on
RFC
FFC
IR
coder
Wifi
Antenna-2
4
Mllr
Mave
2297
4
3
Intel iCore
2+3e
SOC+PCH
3
ISH
Tranlator
Battery
Mux
Fuel Gavge
2
2
UART
MDP
SLDP
Debug
USB 30}
20
U-SDcard connectdr
Surflink connector
Blade
Accessdry
W x H 627 x 406 mm
<OrgName>
<OrgName>
<OrgName>
Size
Size
Size
Project Name
Project Name
Project Name
Custom
Custom
Custom
KBL M DV1p0
KBL M DV1p0
KBL M DV1p0
Date:
Date:
Tuesday, December 13, 2016
Tuesday, December 13, 2016
Tuesday, December 13, 2016
Date:
1
1
Sensors
Left wffi
PES
PES
25
Hall Effect
Acceleromerer
Title:
Title:
Title:
Engineer:
Engineer:
Engineer:
Sheet
Sheet
Sheet
BLOCK DIAGRAM
BLOCK DIAGRAM
BLOCK DIAGRAM
<OrgAddr1>
<OrgAddr1>
<OrgAddr1>
Rev
Rev
Rev
1.00
1.00
1.00
3
3
3
of of
of
76
76
76
D
C
B
A
D
C
B
A
5
5
LPDDR3 - CH B
LPDDR3-1 CH A
M_CHA_CLK[0..1]/#
M_CHB_CLK[0..1]/#
4
4
Intel
KBL Y
CLKOUT_LPC_1
CLKOUT_ITXDP_N
CLKOUT_ITXDP_P
CLKOUT_PCIE_N2
CLKOUT_PCIE_P2
CLKOUT_PCIE_N4
CLKOUT_PCIE_P4
HDA_BCLK
SPI_CLK
RTCX
32.768KHz
XTAL24_IN
24MHz
3
3
CK_24M_TPM
24 MHz
CLK_XDP_N
CLK_XDP_P
100 MHz
PCIE_WIFI_RCLK_N
PCIE_WIFI_RCLK_P
100 MHz
PCIECLK_SSD_DN
PCIECLK_SSD_DP
100 MHz
AZ_BITCLK
24 MHz
SPI_CLK
50 MHz
XDP
WIFI
SSD
AUDIO CODEC
SPI ROM
2
2
TPM
W x H 402 x 260 mm
<Core Design>
<Core Design>
<Core Design>
<OrgName>
<OrgName>
Title:
Title:
1
CLCOK DISTRIBUTION
CLCOK DISTRIBUTION
Title:
CLCOK DISTRIBUTION
Engineer:
Engineer:
<OrgAddr1>
<OrgAddr1>
Engineer:
<OrgName>
<OrgAddr1>
Size
Size
Size
Project Name
Project Name
P
