This model appears to have 3 transmit antennas (see image of the back without cover, near right fan). I think this is a 3x3 wifi model. The non-touch bar model is 2x2.
You must remove the logic board, because the screws for the fan are on the opposite side. However, Apple's modern fans are very long lasting and the hinge-intake airflow design is much less prone to dust build up than laptops with air intakes at the bottom. You should be able to just remove the back panel and blow compressed air into the heatsink from the outside to release all the dust and fiber buildup.
I have no idea what you are trying to say. What is "scam tech" ? What makes it "doomed" ? Microsoft innovative ? Your post is full of hyperbole. It sounds like you became a sheep with a different ranch.
I don't think planned obsolesce is planned for most of Apple's devices. E.g., the iPad 2 was still supported as of this moment through iOS 9.3.5. I do not know of any other tablets from 2011 that are actively updated by their makers today. The iPhones and iPods are the same. Soldered CPUs were introduced by Intel, who phased out PGA-type of CPU interconnects beginning with transition to BGA. Soldered RAM is a double edged sword - while you can't upgrade, you can max out to 16GB of RAM (which is default for a few years now on the 15" MBP), as well, Intel supports faster memory clocks on LPDDR3, which is not available as SODIMMs. As DDR3 SODIMMS are limited to 8GB/DIMM, this isn't an issue. You were never going to be able to upgrade beyond 16GB in the first place as higher density DIMMS are only for DDR4+. The batteries have been a common trend in portable devices since MP3 players. I support Gorilla Glass-types of screen covers as they withstand usage better than polycarbonate.
Based on the tear down, I would say that the cooling system is similar to the pre-2013 MBPs in the way it moves air. It sucks air in from the hinge area and exhausts it via a different portion of the hinge area. This system is less dust-prone compared to the 2013+ models where there are additional slats near the sides to aid cooling. Those slats point downwards and from typical usage (laptop on laps, laptop on bed, laptop on table, etc), the downward pointing nature of the intake picks up a lot of fine fibers and dust from whatever surface is beneath the laptop. I noticed this exact behavior on my 2013 MBP as compared to the earlier 2011 MBP (without slats and hinge-only intake and exhaust).
This model appears to have 3 transmit antennas (see image of the back without cover, near right fan). I think this is a 3x3 wifi model. The non-touch bar model is 2x2.
You must remove the logic board, because the screws for the fan are on the opposite side. However, Apple's modern fans are very long lasting and the hinge-intake airflow design is much less prone to dust build up than laptops with air intakes at the bottom. You should be able to just remove the back panel and blow compressed air into the heatsink from the outside to release all the dust and fiber buildup.
I have no idea what you are trying to say. What is "scam tech" ? What makes it "doomed" ? Microsoft innovative ? Your post is full of hyperbole. It sounds like you became a sheep with a different ranch.
amosbatto:
I don't think planned obsolesce is planned for most of Apple's devices. E.g., the iPad 2 was still supported as of this moment through iOS 9.3.5. I do not know of any other tablets from 2011 that are actively updated by their makers today. The iPhones and iPods are the same. Soldered CPUs were introduced by Intel, who phased out PGA-type of CPU interconnects beginning with transition to BGA. Soldered RAM is a double edged sword - while you can't upgrade, you can max out to 16GB of RAM (which is default for a few years now on the 15" MBP), as well, Intel supports faster memory clocks on LPDDR3, which is not available as SODIMMs. As DDR3 SODIMMS are limited to 8GB/DIMM, this isn't an issue. You were never going to be able to upgrade beyond 16GB in the first place as higher density DIMMS are only for DDR4+. The batteries have been a common trend in portable devices since MP3 players. I support Gorilla Glass-types of screen covers as they withstand usage better than polycarbonate.
Based on the tear down, I would say that the cooling system is similar to the pre-2013 MBPs in the way it moves air. It sucks air in from the hinge area and exhausts it via a different portion of the hinge area. This system is less dust-prone compared to the 2013+ models where there are additional slats near the sides to aid cooling. Those slats point downwards and from typical usage (laptop on laps, laptop on bed, laptop on table, etc), the downward pointing nature of the intake picks up a lot of fine fibers and dust from whatever surface is beneath the laptop. I noticed this exact behavior on my 2013 MBP as compared to the earlier 2011 MBP (without slats and hinge-only intake and exhaust).
It is absurd. The M.2 standard is just fine for everyone. I have no idea why Apple's priority is on skinny.
javierdelkas:
The graphics, the monitor and the touchpad are much nicer in the new Macbook Pro 13". If you treasure any of those, go for the new one.
Is the Wifi indeed 2x2 now ? It was 3x3 before.
I see the base model has now a 2x2 wifi module, whereas the model year before had 3x3, if I remember correctly.