If I understand correctly, reflowing does not solve the problem in the long run because it actually lies in the solder bump area within the underfill, where the main die makes contact with the substrate.
These are tiny balls, almost impossible to fix but with the application of heat the problem is temporarily rectified so as the underfill is moved around etc and some contact may be re-made temporarily, but is largely design error in the chip production and in the end a full swap out is the only real solution.
The issue is *not* in the larger solder balls found where the substrate makes connection to the board, as most people expect.
But it could be in some cases with a warped or bent board.
Sobald er das hat, wird er in der Lage sein, eine Grafik zu seiner im Laufe der Zeit erlangten Reputation zu sehen.
Hier ist eine Vorschau, wie die Grafik aussehen wird:
Noch keine Reputation erlangt.