One is the second photo in step 13 showing the Broadcom IC's. some of the SMD capacitors and resistors are displaced from their correct placement, and is actually quite a mess.
The second observation is the photo in step 20, marked as the die of the A5 IC. I think this is actually the substrate that forms the ball grid array for soldering to the PCB, the IC is bonded out to this around the edges with traces leading to the regular pattern of dots. The dots are where the solder balls locate.
Reputation im Laufe der Zeit
Es sieht aus, als ob dieser Nutzer noch keine Reputation erlangt hat.
Sobald er das hat, wird er in der Lage sein, eine Grafik zu seiner im Laufe der Zeit erlangten Reputation zu sehen.
Hier ist eine Vorschau, wie die Grafik aussehen wird:
Impressive stuff as usual iFixit.
Two observations however.
One is the second photo in step 13 showing the Broadcom IC's. some of the SMD capacitors and resistors are displaced from their correct placement, and is actually quite a mess.
The second observation is the photo in step 20, marked as the die of the A5 IC. I think this is actually the substrate that forms the ball grid array for soldering to the PCB, the IC is bonded out to this around the edges with traces leading to the regular pattern of dots. The dots are where the solder balls locate.