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iPhone 12 Pro Max Teardown

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  • Fair warning, there were some minor casualties in today's board delamination. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our robot intern. Here are some of the bits he managed to salvage:

  • 128 GB of Kioxia NAND flash memory

  • STMicroelectronics STB601A power management IC

  • Qualcomm's SDR865 5G and LTE transceiver, SDX55M 5G modem-RF system, and SMR526 intermediate frequency IC

  • USI 339S00761 WLAN / Bluetooth module

  • Avago 8200 high/mid-band power amplifier with integrated duplexer

  • Murata 1XR-482 mmWave front-end module

  • Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

Achtung, beim heutigen Ablösen der einzelnen Schichten gab es ein paar kleinere Unfälle. Ein kleiner Ausrutscher mit einem Messer bei 300°C reichte, um die Chips komplett vom Board zu fegen. Wir schieben die Schuld auf unseren Roboter-Praktikanten. Hier sind die Teile, die er retten konnte:

128 GB Kioxia NAND Flash-Speicher

ST Microelectronics STB601A Power Management IC

Qualcomm's SDR865 5G und LTE Transceiver, SDX55M 5G Modem-RF System und SMR526 Zwischenfrequenz-IC

USI 339S00761 WLAN / Bluetooth Modul

Avago 8200 Hoch/Mittelband-Leistungsverstärker mit integriertem Duplexer

Murata 1XR-482 mmWave Frontend-Modul

Suchst du nach dem niedlichen A14 Chip, der über den 6GB Speicher geschichtet ist? Hier ist er, leider sieht er ein bisschen schmuddelig aus. (Das ist die Schuld vom Roboter, ehrlich, er hätte es besser wissen müssen und uns nicht eine so delikate Operation anvertrauen sollen).

-[* black] Fair warning, there were some minor casualties in today's [guide|126000|board delamination|stepid=243561|new_window=true]. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our [https://www.ifixit.com/User/1/iRobot|robot intern]. Here are the bits he managed to salvage:
+[* black] Fair warning, there were some minor casualties in today's [guide|126000|board delamination|stepid=243561|new_window=true]. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our [https://www.ifixit.com/User/1/iRobot|robot intern]. Here are some of the bits he managed to salvage:
[* red] 128 GB of [https://business.kioxia.com/en-us/memory/mlc-nand.html|Kioxia NAND flash|new_window=true] memory
- [* orange] ST Microelectronics STB601A power management IC
+ [* orange] STMicroelectronics STB601A power management IC
[* yellow] Qualcomm's [https://www.techinsights.com/blog/analysis-qualcomms-snapdragon-sdr865-transceiver-supporting-5g-sub-6-ghz-and-lte-services|SDR865|new_window=true] 5G and LTE transceiver, [https://www.qualcomm.com/products/snapdragon-x55-5g-modem|SDX55M|new_window=true] 5G modem-RF system, and SMR526 intermediate frequency IC
[* green] USI 339S00761 WLAN / Bluetooth module
[* light_blue] Avago 8200 high/mid-band power amplifier with integrated duplexer
[* blue] Murata 1XR-482 mmWave front-end module
-[* icon_note] Looking for that sweet, sweet A14 chip layered over 6 GB of memory? It's [https://d3nevzfk7ii3be.cloudfront.net/igi/1YHq5IgxtlBb2lxo.full|here|new_window=true], just a little messy. (It's the robot's fault, honestly—he should have known better than to trust us with such a delicate operation.)
+[* icon_note] Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

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