Schritt 11 übersetzen
Schritt 11
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It's time to begin some Surface excavation!
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The front-facing camera and IR sensor are glued to the chassis and trapped beneath the motherboard assembly, which makes for some tricky prying.
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Next, we tackle tons of troublesome tape and deftly disconnect a tangle of connectors.
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We arrive at the headphone jack, only to find that it's connected to the underside of the motherboard assembly by a lengthy cable.
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