Änderungen an Schritt Nr. 5
Bearbeitet von Arthur Shi –
Bearbeitung genehmigt von Arthur Shi
- Vorher
- Nachher
- Unverändert
Schritt-Zeilen
| [* black] Apply a heated iOpener to the bottom edge of the phone for a minute to soften the adhesive. | |
| [* black] Use an opening pick to slice through the bottom edge of the phone. | |
| - | [* icon_note] The adhesive here is as thick as the bezel. Be sure to slice deep enough through the adhesive. |
| + | [* icon_note] The adhesive here is as thick as the bezel. Be sure to slice deep enough to cut through all of the adhesive. |