@zhvladimir - You are correct you need a different kind of thermal material. You need a gapping type one that can span a small distance.
Most thermal paste is designed to fill the micropores of the metal surfaces on tightly pressed surfaces of the heat sink and chip surfaces.
Here the CPU’s heat is dissipated across the lower case as the heat well Vs a Heat sink design which transfers the heat to a radiator which then pushes the heat out via a fan.
Here the gap can’t exceed .25 mm, the efficiency drops as you add distance between the two surfaces. This is the material I use on these systems Dow Corning - 340 White Heat Sink Compound you can get a smaller quantity here MG Chemicals 860-60G
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