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iPhone X 拆解

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Schritt 14
iPhone X Teardown: Schritt 0, Bild 1 von 3 iPhone X Teardown: Schritt 0, Bild 2 von 3 iPhone X Teardown: Schritt 0, Bild 3 von 3
  • Okay, so Apple made a PCB sandwich, but how does it work?

  • They created a third spacer PCB that lines the perimeter. And instead of connecting the two layers with a fussy flex cable, data travels along dozens of through-hole vias.

  • Here, the A11 SoC lies nestled at the center of the main board. You can get a sense of the 3D structure of the board from the X-ray photos. The cylinders around the edge are holes filled with solder connecting the two boards.

苹果做出了一个PCB三明治,但它是如何工作的呢?

他们制造出了一块分隔空间、环绕设计的PCB板,并且利用PCB上数十个孔洞进行数据的传输,而不是通过软性印刷电路进行数据传输

A11仿生处理器位于主板的中央,你可以通过X光照片来进一步了解主板的3D构型,边缘环绕的圆柱体是用于连接两个主板的介质

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