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Sobald er das hat, wird er in der Lage sein, eine Grafik zu seiner im Laufe der Zeit erlangten Reputation zu sehen.
Hier ist eine Vorschau, wie die Grafik aussehen wird:
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8Gb is the capacity for single GDDR6 chip. There are four 8Gb GDDR6 chips. Total video memory capacity is 32Gb(4GB).
it is ST33G1M2 from STMicroelectronics. On the PCB board, it is next to intel PMIC.
339S00458 is much likely WiFi/BT module.
https://globenewswire.com/news-release/2...
It is BCM4375 from Broadcom. But, it should be in the WiFi/BT module made by Murata KM8D03042.
It is not PoP package(Package-on-Package) . From the photo of A12X, it should not be PoP package(processor is next to two memory chips). Is that TSMC’s InFo or CoWos package technology?
HBM can provide higher BW. But, from power consumption, most likely, it can not be. LPDDR4x can provide lower power consumption menory solution for mobile devices, such as iPad.
Qualcomm chip provides GNSS(GPS) feature. It is not necessary to use discrete chip for GPS.
Not DDR3 but LPDDR3. It is limited by intel processor which supports LPDDR3 and DDR4 only. intel processor does not support LPDDR4x.
Dialog https://www.dialog-semiconductor.com/
Dialog used to provide PMIC for Apple iPhone, iPad, Apple TV and iPod. Apple processor-based system always uses Dialog’s PMIC solution. But, from iPhone XS Max, seems, Apple starts to uses its own design on PMIC just as Dialog said that before. refer to https://www.eetimes.com/document.asp?doc...
Is 338S00540 (XS Max) WiFi/Bluetooth module from Murata?
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