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Did I overheat my main board?

I’m new at tech repair but I have a grasp of electrical engineering. I dropped my phone 7 and was unable to use my microphone to record audio files or talk or hear anyone while on a call. Speaker button was grayed out.

I figured it was the Audio IC that had a solder break where it connects with the board.

I attempted to reflow the solder with a heat gun. I used plenty of flux and the process took me longer than expected to get the solder to flow. Started at 350C for a min then to 370C for two min then to 380C for a min. Solder flowed and the chip seemed rested in place when finished.

I put everything back together and when I attach the battery the main board starts to heat up. Could it be that some of my pins under the chip are bridging or did I overheat my main board?

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First of all, reflowing the Audio IC would not have solved your problem, at least not long term. The current best practice is to remove the IC, strengthen the C12 trace (or rebuild if the pad lifted), reball the IC (or replace if it gets damaged) and solder it back into place. Optionally, there are three other pads (F12/H12/J12) that can be strengthened. We are seeing more and more instances of the F12 pad lifting so while you have the audio IC off the board, you may as well do all 4.

In your particular case, it sounds like excess heat may have either bridged some solder balls under the Audio IC or damaged the CPU or Baseband CPU, which is directly opposite the Audio IC. The only way to know is to start probing the main voltage rails provided by the PMIC and the BBPMU to see if there are any shorts. If the issue appears to come from the CPU, that is exponentially more difficult to repair.

Get back to me with your findings.

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Thank you, this is really helpful. I'm hoping to look into it this weekend.

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Blake Bonts wird auf ewig dankbar sein.
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