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The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space: Samsung  K3UH7H70AM-AGCL 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU
  • The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:

  • Samsung K3UH7H70AM-AGCL 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU

  • Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash

  • Broadcom AFEM-9106 front-end module

  • Skyworks SKY78160-51 Low Noise Amplifier

  • Qualcomm SDR8150 RF transceiver

  • Qualcomm WCN3998 WiFi + Bluetooth SoC

  • NXP Semiconductor PN80T NFC controller w/ Secure Element

Das Flip hat ein dichtes, doppelt geschichtetes Motherboard, in der Industrie auch als SLP (substrate-like PCB) bekannt. Wir haben diese platzsparende Technologie zum ersten Mal im iPhone X gesehen und neulich auch im Note 10. Es erschwert zwar die Arbeit von Reparaturexperten für Platinen, ermöglicht aber, viele Chips auf engstem Raum unterzubringen.

Samsung 925 K3UH7H7 (wahrscheinlich 8 GB RAM auf der Snapdragon 855 CPU)

Samsung 949 KLUEG8UHDB (wahrscheinlich der 256 GB Flash-Speicher)

Broadcom AFEM-9106 Front-End Modul

Skyworks 78160-51 rauscharmer Verstärker

Qualcomm SDR8150 RF Transceiver

Qualcomm WCN3998 WiFi + Bluetooth SoC

NXP 80T17 NFC Controller

[* black] The Flip packs a dense, double-stacked motherboard—known in the industry as a [https://www.quick-pcba.com/pcb-news/substrate-like-pcb-technology.html|substrate-like PCB|new_window=true]. We first saw this space-saving technology in the [guide|98975|iPhone X|stepid=182892|new_window=true], and more recently in the [guide|125590|Note10|stepid=242798|new_window=true]. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:
- [* red] Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU)
- [* orange] Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage)
+ [* red] Samsung [link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM-AGCL|new_window=true] 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU
+ [* orange] Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash
[* yellow] Broadcom AFEM-9106 front-end module
- [* green] Skyworks 78160-51 low noise amplifier
+ [* green] Skyworks [link|https://store.skyworksinc.com/products/detail/sky7816051-skyworks/625141/|SKY78160-51|new_window=true] Low Noise Amplifier
[* light_blue] Qualcomm SDR8150 RF transceiver
- [* blue] Qualcomm WCN3998 WiFi + Bluetooth SoC
- [* violet] NXP 80T17 NFC controller
+ [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2018/02/21/qualcomm-introduces-industrys-first-integrated-80211ax-ready-solution|WCN3998|new_window=true] WiFi + Bluetooth SoC
+ [* violet] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T|new_window=true] NFC controller w/ Secure Element

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