Änderungen an Schritt Nr. 5
Bearbeitet von Nicholas Ouimet –
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[* black] And screw the screws in securely. | |
[* black] You want it tight, but not to tight because you will crack the logic board rendering it useless. | |
[* black] We are letting the heat sink spread the thermal paste for us. | |
[* black] this method tends to work the best as when a human spreads it, he/she will spread unevenly. | |
[* black] The finger spreading and flat edge spreading method tend to leave air packets, so the thermal conductivity won't be as good as it should. | |
+ | [* black] The heat sink spreads it evenly. It won't get your fingers or an object dirty. And because it spreads even;y, there are no air bubbles. |