@dext3r that is a FBGA (Fine Ball Grid Array) chip and just like any BGA has all its connections underneath – the BGA body to PCB gap is less than a millimetre or so. You have to get even heating right under the BGA, a cold spot means a defective joint. So you could try a hot air station but it is unlikely to properly penetrate into the small gaps. I’d suggest to do this with an IR Reball Hence why IR BGA Rework station. That way you can control the heat properly and you could follow the reball profile for it as well. Easier , cleaner and just a higher rate of success. Your personal preference will of course dictate what you are going to use.
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@dext3r that is a FBGA (Fine Ball Grid Array) chip and just like any BGA has all its connections underneath – the BGA body to PCB gap is less than a millimetre or so. You have to get even heating right under the BGA, a cold spot means a defective joint. So you could try a hot air station but it is unlikely to properly penetrate into the small gaps. I’d suggest to do this with an IR BGA Rework station. That way you can control the heat properly and you could follow the reball profile for it as well. Easier , cleaner and just a higher rate of success. Your personal preference will of course dictate what you are going to use.
Here is the datasheet for all the dimensions etc. [document|5766]
@dext3r that is a FBGA (Fine Ball Grid Array) chip and just like any BGA has all its connections underneath – the BGA body to PCB gap is less than a millimetre or so. You have to get even heating right under the BGA, a cold spot means a defective joint. So you could try a hot air station but it is unlikely to properly penetrate into the small gaps. I’d suggest to do this with an IR Reball Hence why IR BGA Rework station. That way you can control the heat properly and you could follow the reball profile for it as well. Easier , cleaner and just a higher rate of success. Your personal preference will of course dictate what you are going to use.
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Here is the datasheet for all the dimensions etc. [document|5766]
@dext3r that is a FBGA (Fine Ball Grid Array) chip and just like any BGA has all its connections underneath – the BGA body to PCB gap is less than a millimetre or so. You have to get even heating right under the BGA, a cold spot means a defective joint. So you could try a hot air station but it is unlikely to properly penetrate into the small gaps. I’d suggest to do this with an IR Reball Hence why IR BGA Rework station. That way you can control the heat properly and you could follow the reball profile for it as well. Easier , cleaner and just a higher rate of success. Your personal preference will of course dictate what you are going to use.