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iPhone 8 Plus 拆解

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Schritt 9
iPhone 8 Plus Teardown: Schritt 0, Bild 1 von 2 iPhone 8 Plus Teardown: Schritt 0, Bild 2 von 2
  • Let's take a look at what the iPhone 8 Plus has under the hood:

  • Apple 339S00439 A11 Bionic SoC layered over Samsung 3 GB LPDDR4 RAM

  • Qualcomm MDM9655 Snapdragon X16 LTE modem

  • Skyworks SkyOne SKY78140

  • Avago 8072JD112

  • P215 730N71T - likely an envelope tracking IC

  • Skyworks SKY77366-17 quad-band GSM power amplifier module

  • NXP Semiconductor 80V18 (PN80V) secure NFC module

让我们来看看这块主板上有些什么吧:

苹果(Apple)339S00439 A11仿生处理器,预封装三星(Samsung)制3GB LPDDR4X运存

高通(Qualcomm)骁龙 MDM9655 X16 LTE模组

思佳讯(Skyworks)SkyOne SKY78140

安华高科技(Avago)8072JD112

P215 730N71T —可能是追信IC模块

思佳讯(Skyworks)77366-17 四波段GSM功率放大器

恩智浦半导体(NXP)80V18 NFC加密模块

[* black] Let's take a look at what the iPhone 8 Plus has under the hood:
[* red] Apple [https://en.wikipedia.org/wiki/Apple_A11|339S00439|new_window=true] A11 Bionic SoC layered over Samsung 3 GB LPDDR4 RAM
[* orange] Qualcomm [https://www.qualcomm.com/products/snapdragon/modems/4g-lte/x16|MDM9655|new_window=true] Snapdragon X16 LTE modem
[* yellow] Skyworks SkyOne SKY78140
[* green] Avago 8072JD112
[* light_blue] P215 730N71T - likely an envelope tracking IC
- [* blue] Skyworks 77366-17 quad-band GSM power amplifier module
- [* violet] NXP [https://www.nxp.com/packages/PN80V|80V18|new_window=true] secure NFC module
+ [* blue] Skyworks SKY77366-17 quad-band GSM power amplifier module
+ [* violet] NXP Semiconductor [https://www.nxp.com/packages/PN80V|80V18|new_window=true] (PN80V) secure NFC module

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